Gold Member Since 2011
Audited Supplier
Guangdong Zhengye Technology Co., Ltd.

Laser Cutter, Laser Cutting Engraving Machine, Laser Cutting manufacturer / supplier in China, offering UV Laser Cutting Machine for Cvl/FPC/RF and Thin Multilayer Board, 2017 Hole Checker for Inspection, 2017 New X-ray Inspection Machine and so on.

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Supplier Homepage Product UV Laser Cutting Machine UV Laser Cutting Machine for Cvl/FPC/RF and Thin Multilayer Board

UV Laser Cutting Machine for Cvl/FPC/RF and Thin Multilayer Board

FOB Price: Get Latest Price
Min. Order: 1 Set
Port: Shenzhen, China
Production Capacity: 100 Sets/Year
Payment Terms: L/C, T/T, D/P, Western Union, Paypal

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Basic Info
  • Model NO.: JG16
  • Cooling System: Air Cooling
  • Applicable Material: FPC PCB Cover Layer
  • Laser Classification: Free Electron Laser
  • Type for Cutting Machine: CNC Cutting Machine
  • Automation: Automatic
  • Condition: New
  • Transport Package: Wooden Carton
  • Origin: China Guangdong
  • Application: Home Appliance, Environmental Equipment, Petroleum Machinery Manufacturing, Agriculture Machinery, Textile Machinery, Food Machinery, Aerospace Industry, Automotive Industry, Shoemaking Industry, Woodwork Industry, Advertising Industry
  • Technical Class: Continuous Wave Laser
  • Structure Type: Desktop
  • Laser Technology: Laser Vapor Cutting
  • Certification: SGS, Ce, RoHS, ISO 9001:2000
  • Type for Pipe and Tube Bending Machine: Electric Hydraulic Pipe Bender
  • Trademark: ASIDA
  • Specification: CE, ROHS, ISO9000
  • HS Code: 8456100090
Product Description

UV Laser Cutting Machine for Cvl/FPC/RF and Thin Multilayer Board                  High Quality Cutting Machine for PCB and FPC
1. Usage 
Precisive cutting of FPC and organic membrane covering board without molds or the protection plate. High-energy laser source and precise control of laser beams can improve the processing speed and the accuracy of processing results. It has all the functions same as the one produced by LPKF but price is lower. 

2. Characteristic 
2.1. Independent intellectual property rights of the control software, Humanized interface, complete functions and simple operation. 
2.2. Processing any graphic, cutting different thickness and different materials, stratified processing and complete synchronously 
2.3. Adopt high-performance ultraviolet light laser with short wave length, high beam quality and higher peak power properties. Because ultraviolet light is through decomposition, vaporization instead of melting to cutting the materials, so almost no burrs after processing, small thermal effect, no stratification, precise cutting effects, smooth, steep sidewall. 
2.4. Fixed sample by using Vacuum mode, without matrix protection plate, convenient and improving the processing efficiency. 
2.5. Used for a variety of substrate materials cutting, such as: Silicon, ceramics, glass, etc. 

2.6. Automatic correction, automatic positioning and multi board cutting function. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.
UV Laser Cutting Machine for Cvl/FPC/RF and Thin Multilayer Board

Item Specification
Laser Source355nm All-solid-state UV laser cutting device,wavelength 355nm
Laser Power10W
Maximum Processing Size,720mm×540 mm(21″×28″)
XY Platform Maximum Operating Speed50m/min
Positioning accuracy±3µm
Repeat accuracy±1µm
System Processing Precision±20µm
Galvanometer scanning range50mm X 50mm
 Cutting Thickness≤1mm
PowerAC 220V/50Hz/2.2KW;380V/50Hz/5.5KW
Vacuum Requirements516m3/h
Overall Dimensions1818mm×2317 mm×1550 mm
Environmental Temperature20ºC±1ºC
Humidity<60%RH (No dew)
Ground Amplitude<5µm
Vibration Acceleration<0.05G
Ground Pressure2200kgf/m2
Industry-specific control machine, computer equipped flexible processing softwareMotion control card and industry machine control mode
Equipped with 17 screens, 100G hard disk
standard G code, Gerber data, CAD-compatible

UV Laser Cutting Machine for Cvl/FPC/RF and Thin Multilayer Board
UV Laser Cutting Machine for Cvl/FPC/RF and Thin Multilayer Board4.Video at YouTube


5.Please let us know following informations: 

1.What kind of material do you want to cut?
2.What is the mostly used thickness and what is the maximum thickness?
3. What is the MAX. dimension of your materials ?
4. Are you an end user or reseller?
According to your above information,we'll recommend the most suitable machine to you.










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