UV Laser Cutting Machine for Cvl/FPC/RF and Thin Multilayer Board
|FOB Price:||Get Latest Price|
|Min. Order:||1 Set|
|Production Capacity:||100 Sets/Year|
|Payment Terms:||L/C, T/T, D/P, Western Union, Paypal|
- Model NO.: JG16
- Cooling System: Air Cooling
- Applicable Material: FPC PCB Cover Layer
- Laser Classification: Free Electron Laser
- Type for Cutting Machine: CNC Cutting Machine
- Automation: Automatic
- Condition: New
- Transport Package: Wooden Carton
- Origin: China Guangdong
- Application: Home Appliance, Environmental Equipment, Petroleum Machinery Manufacturing, Agriculture Machinery, Textile Machinery, Food Machinery, Aerospace Industry, Automotive Industry, Shoemaking Industry, Woodwork Industry, Advertising Industry
- Technical Class: Continuous Wave Laser
- Structure Type: Desktop
- Laser Technology: Laser Vapor Cutting
- Certification: SGS, Ce, RoHS, ISO 9001:2000
- Type for Pipe and Tube Bending Machine: Electric Hydraulic Pipe Bender
- Trademark: ASIDA
- Specification: CE, ROHS, ISO9000
- HS Code: 8456100090
High Quality Cutting Machine for PCB and FPC
Precisive cutting of FPC and organic membrane covering board without molds or the protection plate. High-energy laser source and precise control of laser beams can improve the processing speed and the accuracy of processing results. It has all the functions same as the one produced by LPKF but price is lower.
2.1. Independent intellectual property rights of the control software, Humanized interface, complete functions and simple operation.
2.2. Processing any graphic, cutting different thickness and different materials, stratified processing and complete synchronously
2.3. Adopt high-performance ultraviolet light laser with short wave length, high beam quality and higher peak power properties. Because ultraviolet light is through decomposition, vaporization instead of melting to cutting the materials, so almost no burrs after processing, small thermal effect, no stratification, precise cutting effects, smooth, steep sidewall.
2.4. Fixed sample by using Vacuum mode, without matrix protection plate, convenient and improving the processing efficiency.
2.5. Used for a variety of substrate materials cutting, such as: Silicon, ceramics, glass, etc.
2.6. Automatic correction, automatic positioning and multi board cutting function. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.
|Laser Source||355nm All-solid-state UV laser cutting device,wavelength 355nm|
|Maximum Processing Size,||720mm×540 mm(21″×28″)|
|XY Platform Maximum Operating Speed||50m/min|
|System Processing Precision||±20µm|
|Galvanometer scanning range||50mm X 50mm|
|Overall Dimensions||1818mm×2317 mm×1550 mm|
|Humidity||<60%RH (No dew)|
|Industry-specific control machine, computer equipped flexible processing software||Motion control card and industry machine control mode|
Equipped with 17 screens, 100G hard disk
standard G code, Gerber data, CAD-compatible
4.Video at YouTube
5.Please let us know following informations:
1.What kind of material do you want to cut?
2.What is the mostly used thickness and what is the maximum thickness?
3. What is the MAX. dimension of your materials ?
4. Are you an end user or reseller?
According to your above information,we'll recommend the most suitable machine to you.