UV Laser Drilling Machine(Model:JG22)
The machine is used to drilling via of FPC flexible printed circuit board, and cover layer cutting , FPC flexible printed circuit board cutting, RF rigid-flexible circuit board cutting.
1.Precision: Using linear motor, high resolution raster ruler, higher shrinkage compensation and advanced image processing technology, fully guaranteed drilling, cutting accuracy and quality.
2.High quality: Roundness is good and clean. The top and bottom diameter of hole are consistent. The min via hole diameter is 50um.
3.Highly intelligent, efficient: Auto-focus, auto-calibrate, auto-position, auto loading and unloading material by RTR.
|Specification of UV Laser Drilling Machine (ASIDA JG22)|
|System Processing Accuracy ( ZHENGYE Conditions)||±25μm|
|Drilling Speed (ZHENGYE Conditions)||150 hole per second|
|Differences Between Up and Down Hole Diameter||≤12.5μm|
|Objects||Maximum Processing Size||540mmX650mm|
|Processing Capacity||Via hoe drilling, PTH cutting|
|Minimum Processing Hole Diameter||75μm|
|Laser Wavelength||355 nm|
|Pressured Air||>0.6MPa;500L per minute|
|Power Supply||Single phase, 220V,50Hz, 2.5KW|