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UV Laser Depaneling Machine (JG15S)
| Negotiable | 1 Piece (MOQ) |
Min. Order:
1 Piece
Port:
Shenzhen, China
Production Capacity:
30sets/Year
Payment Terms:
L/C, T/T
Guangdong Zhengye Technology Co., Ltd.
Guangdong, China
Last Login Date:
Sep 12, 2024
Business Type:
Manufacturer/Factory, Group Corporation
Main Products:
Laser Machine, Laser Marking Machine, X-ray Machine, Laser Engraving Machine, Flex Circuit Laser Drilling Machine, Multilayers Hole Inspection Machine, CO2 Laser Cutting Machine, Fiber Laser Cutting Machine, PCB Tester, Circuit Tester
Product Description
Company Info
Basic Info.
Model NO.
JG15S
Application
Environmental Equipment, Petroleum Machinery Manufacturing, Agriculture Machinery, Food Machinery, Aerospace Industry, Automotive Industry, Advertising Industry
Cooling System
Air Cooling
Technical Class
Pulse Laser
Applicable Material
Nonmetal
Structure Type
Gantry Type
Laser Classification
Solid Laser
Laser Technology
UV Laser Cutting Machine
Weight
3500kg
Laser
UV Laser Cutting
Laser Cutter
Asida Jg15s
Cutting Machine
UV Laser
FPC Cutting Machine
Asida Machine
Trademark
zhengye
Transport Package
as Per Customers′ Requirements
Specification
CE, SGS, ISO9001
Origin
China
HS Code
845610
Product Description
ASIDA-JG15S UV Laser Depaneling machine
1. Usage
Precisive cutting of FPC and organic membrane covering board without molds or the protection plate. High-energy laser source and precise control of laser beams can improve the processing speed and the accuracy of processing results. It has all the functions same as the one produced by LPKF but price is lower.
2. Characteristic
2.1. Independent intellectual property rights of the control software, Humanized interface, complete functions and simple operation.
2.2. Processing any graphic, cutting different thickness and different materials, stratified processing and complete synchronously
2.3. Adopt high-performance ultraviolet light laser with short wave length, high beam quality and higher peak power properties. Because ultraviolet light is through decomposition, vaporization instead of melting to cutting the materials, so almost no burrs after processing, small thermal effect, no stratification, precise cutting effects, smooth, steep sidewall.
2.4. Fixed sample by using Vacuum mode, without matrix protection plate, convenient and improving the processing efficiency.
2.5. Used for a variety of substrate materials cutting, such as: Silicon, ceramics, glass, etc.
2.6. Automatic correction, automatic positioning and multi board cutting function. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.
1. Usage
Precisive cutting of FPC and organic membrane covering board without molds or the protection plate. High-energy laser source and precise control of laser beams can improve the processing speed and the accuracy of processing results. It has all the functions same as the one produced by LPKF but price is lower.
2. Characteristic
2.1. Independent intellectual property rights of the control software, Humanized interface, complete functions and simple operation.
2.2. Processing any graphic, cutting different thickness and different materials, stratified processing and complete synchronously
2.3. Adopt high-performance ultraviolet light laser with short wave length, high beam quality and higher peak power properties. Because ultraviolet light is through decomposition, vaporization instead of melting to cutting the materials, so almost no burrs after processing, small thermal effect, no stratification, precise cutting effects, smooth, steep sidewall.
2.4. Fixed sample by using Vacuum mode, without matrix protection plate, convenient and improving the processing efficiency.
2.5. Used for a variety of substrate materials cutting, such as: Silicon, ceramics, glass, etc.
2.6. Automatic correction, automatic positioning and multi board cutting function. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.
| Specifications of UV Laser Cutting Machine | |
| Model | JG15S |
| Wavelength | 355nm |
| Laser Power | 10W |
| Laser Frequency | 30-120kHz |
| Maximum Processing Size | 250mm×300mm |
| Maximum Operating Speed | 500mm/s |
| Positioning Accuracy of Table | ±3μm |
| Repetitive Positioning Accuracy of Table | ±1μm |
| Total Accuracy | ±20um |
| light spots | 20±5μm |
| Scanning range | 40x40mm |
| File Format | *.gbr & *.dxf & *.lay |
| Electric Power Supply | AC220V/2kW; AC380V/1.5kW |
| Dimensions(L x W x H) | 1050mm×1000mm×1610mm |
| Weight | 700kg |
| Environmental Temperature | 20±2ºC |
| Environmental Humidity | Non-condensing |
| Ground Amplitude | ≤5μm |
| Ground Pressure | ≥700Kgf/m2 |
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