11W UV laser drilling system for small blind vias of PCB
The machine is used in drilling through holes, blind holes of FPC and cutting the CVL/FPC/RF.
1.Precision: Using linear motor, high resolution raster ruler, higher shrinkage compensation and advanced image processing technology, fully guaranteed drilling, cutting accuracy and quality.
2.High quality: Roundness is good and clean. The top and bottom diameter of hole are consistent. The min via hole diameter is 50um.
3.Highly intelligent, efficient: Auto-focus, auto-calibrate, auto-position, auto loading and unloading material by RTR.
1.High efficiency: Flying drilling technology, table and galvanometer with linkages are applied in machine to improve blind/through holes production.
2.High quality: Adopting imported laser, high-performance galvanometer, higher pulse frequency, higher power peak, more fine cutting path planning.
3.Automactic: There are functions with automatically precision correction, automatical power compesation, automatical focus and automatic correcting movement and high interactivity.
4.Customized: Customizable 250 mm or 500 mm wide RTR automatic loading system and various kinds of software functions.
5.Security: Following standard to d esign and produce machine, to achieve better quality in every steps, long work time without any downtime.
6.Stability: Following standard to d esign and produce machine, to achieve better quality in every steps, long work time without any downtime.
7.Reliability: AOM module is applied to correct power by single pulse sampling, to make drilling quality consistency and reliability.
ROLL TO ROLL
System Processing Accuracy ( ZHENGYE Conditions)
| Drilling Speed (ZHENGYE Conditions)||180 holes/s||>200holes/s|
Differences Between Up and Down Hole Diameter
| Maximum Processing Size||550mmX650mm|
Minimum Processing Hole Diameter
|Drilling through holes, blind hoes||50μm(through holes)||50μm|
| Dimensions (L×W×H)||1610mmx1660mmx1600mm||1600mmx1650mmx1940mm|